GE XVME-230 Intelligent Counter Module/Board
Description
| Manufacture | GE |
| Model | XVME-230 |
| Ordering information | XVME-230 |
| Catalog | Multilin |
| Description | GE XVME-230 Intelligent Counter Module/Board |
| Origin | USA |
| HS Code | 3595861133822 |
| Dimension | 3.2cm*10.7cm*13cm |
| Weight | 0.3kg |
Details
1.3.2 XYCOM Intelligent VO Kernel The ICM is based upon a XYCOM intelligent I/O kernel, which is built around a IOMHz 68000 microprocessor unit. This kernel, in combination with on-board firmware, performs many. of the time-consuming tasks that are inherent to measurement and control functions. The intelligent kernel, in conjunction with interrupt control circuitry, interfaces the ICM measurement and control functions to the VMEbus Gee Figure 1- 1). The XYCOM intelligent 110 kernel has the following features: 68000 microprocessor with 7 internal interrupt levels 2 PROM and 2 RAM sockets which accept various sizes Slave functions (A16:D 16) VMEbus Requester (RO-R3) VMEbus Interrupter (11-17) Programmable Address Decode Circuitry Self-Test Status Register Module Identification PASS, FAIL, and HALT LED indicators 1.4 XYCOM STANDARD I/O ARCHITECTURE The ICM is designed in accordance with XYCOM's Standard 110 Architecture which is specified for all XVME 110 modules in order to provide a simple and consistent method of programming for the entire module line. The features standardized by the XYCOM 110 Architecture are the following: 1. Module Addressing -- Where a module is positioned in memory and how software can read from it or write to it. 2. Module Identification -- How software can identify which modules are installed in a system. 3. Module Operational Status -- How the operator can determine, through software, the "health" of specific modules within the system. 4. Interrupt Control -- How software controls and monitors the capability of the module to interrupt the system. 5. Communication between Modules -- How master processors and intelligent I/O modules communicate through shared or global memory, or through the 110 modules dual-access RAM.
















