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GE DS215TCCBG3BZZ01B DS200TCCBG3BED Analog I/O Board

short description:

Item no:DS215TCCBG3BZZ01B DS200TCCBG3BED

brand:GE

price:$5500

Delivery time: In Stock

Payment: T/T

shipping port: xiamen


Product Detail

Product Tags

Description

Manufacture GE
Model DS215TCCBG3BZZ01B DS200TCCBG3BED
Ordering information DS215TCCBG3BZZ01B DS200TCCBG3BED
Catalog MARK V
Description GE DS215TCCBG3BZZ01B DS200TCCBG3BED Analog I/O Board
Origin USA
HS Code 3595861133822
Dimension 3.2cm*10.7cm*13cm
Weight 0.3kg

 

Details

About the DS200TCCBG3BED

Developed for General Electric’s Mark V Turbine Control System, the DS200TCCBG3BED is a dedicated printed circuit board (PCB). The Mark V platform is deployed within control and supervisory systems for automated wind, steam and gas turbine drive units, standing among GE’s later‑generation Mark hardware families built around the company’s proprietary Speedtronic control technology.

Officially designated as a Common Extended Analog I/O Board in GE’s original Mark V documentation, the DS200TCCBG3BED delivers extended analog input‑output capabilities for the turbine system. It is not the baseline hardware for this function within the Mark V ecosystem; its predecessor is the DS200TCCBG3 base PCB, which lacks the three major functional revisions implemented on the DS200TCCBG3BED variant.
Hardware Tips and Specifications

This GE TC2000 analog I/O board integrates an 80196 microprocessor alongside several PROM modules. Hardware layout includes one status LED and two 50‑pin connectors marked JCC and JDD. The side‑mounted LED offers quick visual feedback for basic fault and operational diagnostics. Five additional 34‑pin connectors are also populated on the board.

Special installation considerations apply due to the multiple ribbon cables interfaced with the DS200TCCBG3BED. Industry best practice recommends separating signal wiring from power cables and keeping parallel cable segments as short as possible. Crosstalk interference can be greatly reduced by arranging signal and power lines to intersect at a 90‑degree angle. Fibre‑optic links are immune to electrical noise and may run adjacent to power wiring without risk. Improperly arranged ribbon cables can obstruct airflow over heat‑generating critical components. When fitting a replacement DS200TCCBG3BED unit, replicate the original cable routing to preserve thermal performance and signal integrity. Full descriptions of onboard interfaces are documented within the factory‑issued manual. Key connectors comprise:

The 2PL TCPS Power Distribution Connector

The 3PL COREBUS Conditioned Signals Connector

The JHH TBCB Board Input Signals Connector

The JII TBCB Board RTD Input Signals Connector

The JMP TCEB Board Potential and Current Signals Connector

The JKK Connector

The JTEST Connector

The TCQPL Connector

These interface identifiers originate from factory silkscreen labels, Mark V interfacing definitions, and the practical roles each port serves for the DS200TCCBG3BED and the broader turbine drive system. The PCB assembly features a conformal protective coating, a robust chemical layer that shields circuit traces and soldered components against routine wear and environmental degradation.
Bear in mind prior to procurement that hardware characteristics including factory performance parameters and physical dimensions of the DS200TCCBG3BED have been adjusted across its three successive revision updates.
DS200TCCBG3BED

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